Hot Melt Adhesive
Hot-melt adhesive is a thermoplastic material, solid at room temperature which is applied molten and sticks to the surface on cooling. The strength of the instantaneous joint obtained has allowed high-speed machinery to be developed for its application in areas such as shoe manufacture, packaging, furniture or nappy or cigarette manufacturing.
Paraffin wax and micro wax are widely used in most hot melt adhesive formulations to control the viscosity of the adhesive and contribute to open time, flexibility and elongation.
HCI has a rich experience in supplying high quality paraffin wax and micro wax to adhesive industry. Our wax products consistently performing perfectly in lots of different adhesive formulations from different customers.
|Product||Drop/Melting Point ℃/℉
|Oil Content Max%
|Color in Saybolt or No.
|Needle Penetration 1/10mm @25℃
|Kinematic Viscocity @212℉
|Flash Point ℃
|FT FR80||≤ 86.0||≤ 1.0||≥ +20||≤ 12||N/A||8～12||≤ 0.01||N/A|
|FT FR115||112.0~116.0||≤ 0.5||≥ +15||≤ 3||N/A||22~27||≤ 0.01||N/A|
|FT FR105A||≤ 115.0||≤ 0.5||≥ +15||≤ 5||N/A||25～30||≤ 0.01||N/A|
|FT FR100||≤ 110.0||≤ 0.5||≥ +15||≤ 6||N/A||27～32||≤ 0.01||N/A|
|FT FR90||89.0~92.0||≤ 0.5||≥ +20||≤ 10||N/A||8~13||≤ 0.01||N/A|